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Physics > Instrumentation and Detectors
Title: Timing resolution performance of Timepix4 bump-bonded assemblies
(Submitted on 23 Apr 2024)
Abstract: The timing performance of the Timepix4 application-specific integrated circuit (ASIC) bump-bonded to a $100\;\mu\textrm{m}$ thick n-on-p silicon sensor is presented. A picosecond pulsed infrared laser was used to generate electron-hole pairs in the silicon bulk in a repeatable fashion, controlling the amount, position and time of the stimulated charge signal. The timing resolution for a single pixel has been measured to $107\;\textrm{ps}$ r.m.s. for laser-stimulated signals in the silicon sensor bulk. Considering multi-pixel clusters, the measured timing resolution reached $33\;\textrm{ps}$ r.m.s. exploiting oversampling of the timing information over several pixels.
Submission history
From: Riccardo Bolzonella [view email][v1] Tue, 23 Apr 2024 20:22:10 GMT (4659kb,D)
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