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Quantum Physics
Title: A multi-module silicon-on-insulator chip assembly containing quantum dots and cryogenic radio-frequency readout electronics
(Submitted on 7 May 2024 (v1), last revised 8 May 2024 (this version, v2))
Abstract: Quantum processing units will be modules of larger information processing systems containing also digital and analog electronics modules. Silicon-based quantum computing offers the enticing opportunity to manufacture all the modules using the same technology platform. Here, we present a cryogenic multi-module assembly for multiplexed readout of silicon quantum devices where all modules have been fabricated using the same fully-depleted silicon-on-insulator (FDSOI) CMOS process. The assembly is constituted by three chiplets: (i) a low-noise amplifier (LNA), (ii) a single-pole eight-throw switch (SP8T), and (iii) a silicon quantum dot (QD) array. We characterise each module individually and show (i) a gain over 35 dB, a bandwidth of 118 MHz, a minimum noise temperature of 4.2 K, (ii) an insertion loss smaller than 1.1 dB, a noise temperature smaller than 1.1 K across 0-2 GHz, and (iii) single-electron box (SEB) charge sensors. Finally, we combine all elements into a single demonstration showing time-domain radio-frequency multiplexing of two SEBs paving the way to an all-silicon quantum computing system.
Submission history
From: Alberto Gomez-Saiz [view email][v1] Tue, 7 May 2024 08:19:01 GMT (4850kb,D)
[v2] Wed, 8 May 2024 16:34:15 GMT (4850kb,D)
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