We gratefully acknowledge support from
the Simons Foundation and member institutions.

Hardware Architecture

Authors and titles for recent submissions, skipping first 25

[ total of 34 entries: 1-25 | 26-34 ]
[ showing 25 entries per page: fewer | more | all ]

Wed, 1 May 2024 (continued, showing last 9 of 10 entries)

[26]  arXiv:2404.19381 [pdf, other]
Title: Low-overhead General-purpose Near-Data Processing in CXL Memory Expanders
Authors: Hyungkyu Ham, Jeongmin Hong, Geonwoo Park, Yunseon Shin, Okkyun Woo, Wonhyuk Yang, Jinhoon Bae, Eunhyeok Park, Hyojin Sung, Euicheol Lim, Gwangsun Kim
Subjects: Hardware Architecture (cs.AR)
[27]  arXiv:2404.19354 [pdf, other]
Title: PEFSL: A deployment Pipeline for Embedded Few-Shot Learning on a FPGA SoC
Authors: Lucas Grativol Ribeiro (IMT Atlantique - MEE, Lab\_STICC\_BRAIn, Lab-STICC\_2AI, LHC), Lubin Gauthier (Lab\_STICC\_BRAIn, IMT Atlantique - MEE), Mathieu Leonardon (IMT Atlantique - MEE, Lab\_STICC\_BRAIn), Jérémy Morlier (IMT Atlantique - MEE, Lab\_STICC\_BRAIn), Antoine Lavrard-Meyer (IMT Atlantique), Guillaume Muller (Mines Saint-Étienne MSE, FAYOL-ENSMSE, FAYOL-ENSMSE), Virginie Fresse (LHC, TSE), Matthieu Arzel (IMT Atlantique - MEE, Lab-STICC\_2AI)
Journal-ref: ISCAS 2024 : IEEE International Symposium on Circuits and Systems, May 2024, Singapore, Singapore
Subjects: Hardware Architecture (cs.AR); Machine Learning (cs.LG)
[28]  arXiv:2404.19180 [pdf, other]
Title: MACO: Exploring GEMM Acceleration on a Loosely-Coupled Multi-core Processor
Authors: Bingcai Sui, Junzhong Shen, Caixia Sun, Junhui Wang, Zhong Zheng, Wei Guo
Subjects: Hardware Architecture (cs.AR)
[29]  arXiv:2404.19489 (cross-list from cs.CV) [pdf, other]
Title: EvGNN: An Event-driven Graph Neural Network Accelerator for Edge Vision
Authors: Yufeng Yang, Adrian Kneip, Charlotte Frenkel
Comments: 12 pages, 14 figures
Subjects: Computer Vision and Pattern Recognition (cs.CV); Hardware Architecture (cs.AR); Emerging Technologies (cs.ET); Neural and Evolutionary Computing (cs.NE)
[30]  arXiv:2404.19448 (cross-list from cs.RO) [pdf, other]
Title: Sensorized Soft Skin for Dexterous Robotic Hands
Authors: Jana Egli (1), Benedek Forrai (1), Thomas Buchner (1), Jiangtao Su (2), Xiaodong Chen (2), Robert K. Katzschmann (1) ((1) ETH Zurich, (2) Nanyang Technological University Singapore)
Comments: 6 pages, 9 figures ICRA 2024
Subjects: Robotics (cs.RO); Hardware Architecture (cs.AR)
[31]  arXiv:2404.19331 (cross-list from cs.PF) [pdf, other]
Title: Fusing Depthwise and Pointwise Convolutions for Efficient Inference on GPUs
Authors: Fareed Qararyah, Muhammad Waqar Azhar, Mohammad Ali Maleki, Pedro Trancoso
Subjects: Performance (cs.PF); Hardware Architecture (cs.AR); Distributed, Parallel, and Cluster Computing (cs.DC)
[32]  arXiv:2404.19246 (cross-list from cs.CR) [pdf, ps, other]
Title: Logistic Map Pseudo Random Number Generator in FPGA
Authors: Mateo Jalen Andrew Calderon, Lee Jun Lei Lucas, Syarifuddin Azhar Bin Rosli, Stephanie See Hui Ying, Jarell Lim En Yu, Maoyang Xiang, T. Hui Teo
Comments: 10 pages, 6 figures
Subjects: Cryptography and Security (cs.CR); Hardware Architecture (cs.AR)
[33]  arXiv:2404.19203 (cross-list from physics.app-ph) [pdf, ps, other]
Title: Thermal Performance of a Liquid-cooling Assisted Thin Wickless Vapor Chamber
Authors: Arani Mukhopadhyay, Anish Pal, Mohamad Jafari Gukeh, Constantine M. Megaridis (Mechanical and Industrial Engineering, University of Illinois Chicago, IL, US.)
Comments: Presented at IEEE ITherm (Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems) 2023. Orlando, FL, US. Corresponding: cmm@uic.edu
Subjects: Applied Physics (physics.app-ph); Hardware Architecture (cs.AR); Systems and Control (eess.SY)
[34]  arXiv:2404.19195 (cross-list from eess.SY) [pdf, ps, other]
Title: Evaluation of Thermal Performance of a Wick-free Vapor Chamber in Power Electronics Cooling
Authors: Arani Mukhopadhyay (1), Anish Pal (1), Congbo Bao (2), Mohamad Jafari Gukeh (1), Sudip K. Mazumder (2), Constantine M. Megaridis (1) ((1) Mechanical and Industrial Engineering, University of Illinois Chicago, IL, US. (2) Electrical and Computer Engineering, University of Illinois Chicago, IL, US.)
Comments: Presented at IEEE ITherm (Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems) 2023, Orlando FL. Corresponding author: cmm@uic.edu
Subjects: Systems and Control (eess.SY); Hardware Architecture (cs.AR); Applied Physics (physics.app-ph)
[ total of 34 entries: 1-25 | 26-34 ]
[ showing 25 entries per page: fewer | more | all ]

Disable MathJax (What is MathJax?)

Links to: arXiv, form interface, find, cs, new, 2405, contact, help  (Access key information)